SiC Diode with Vertical Superjunction Realized Using Channeled Implant and Multi-Step Epitaxial Growth
نویسندگان
چکیده
This work details two approaches with multi-epitaxial growth to create a vertical superjunction structure made of alternating pillars. One approach is chain very high energy implants, the other uses preferred implantation direction achieve channeled profile. The manufactured devices show breakdown voltage 1000 V for channeled, two-step epi total 4.9 μm thickness. 800 regular implants using three steps 3.7 measured Rsp was 0.7 mOhm*cm 2 dies size 0.018 cm . UIS and temperature measurement reliable performance. implant looks favorable reduce number process needed an efficient structure.
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ژورنال
عنوان ژورنال: Materials Science Forum
سال: 2022
ISSN: ['1422-6375', '0250-9776', '0255-5476', '1662-9752', '1662-9760']
DOI: https://doi.org/10.4028/p-ix1o7m